BH provides complete turnkey solutions involving printed circuit board (PCB) assemblies, box builds and wire harness assemblies. We provide quick-turn prototype, production PCB assembly with surface-mount (SMT), through-hole (THT) and mix components. We can handle small quantity as well as volume productions.
Our Technology Capabilities:
SMT & THT
Wire bonding and encapsulation
Chip On Board/Flex (COB)
Electro-Mechanical & Box-Build Assembly
Lead Free/Leaded Process Capabilities
BGA Repair/Rework Capability
PCB layer count up to 24 layers
Ultra sonic cleaning
BH adopts a variety of testing methodologies to ensure the assembled boards are functional prior to shipping. They are:
Basic Quality Test: visual inspection.
X-ray Inspection: tests for BGAs, QFN and bare PCBs.
AOI Checks: tests for solder paste, 0201 components, missing components and polarity.
ICT (In-Circuit Test) / Functional test: according to the customer’s testing procedures.