BH provides complete turnkey solutions involving printed circuit board (PCB) assemblies, box builds and wire harness assemblies. We provide quick-turn prototype, production PCB assembly with surface-mount (SMT), through-hole (THT) and mix components. We can handle small quantity as well as volume productions. 

Our Technology Capabilities:

  • SMT & THT
  • Wire bonding and encapsulation
  • Chip On Board/Flex (COB)
  • Electro-Mechanical & Box-Build Assembly
  • Lead Free/Leaded Process Capabilities
  • BGA Repair/Rework Capability
  • PCB layer count up to 24 layers
  • Ultra sonic cleaning

BH adopts a variety of testing methodologies to ensure the assembled boards are functional prior to shipping. They are:

  • Basic Quality Test: visual inspection.
  • X-ray Inspection: tests for BGAs, QFN and bare PCBs.
  • AOI Checks: tests for solder paste, 0201 components, missing components and polarity.
  • ICT (In-Circuit Test) / Functional test: according to the customer’s testing procedures.